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Capabilities

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                 Design    

Vacuum Brazing

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Dont settle for off-the-shelf solutions!  We can design for a given space requirement in terms of physiology and/or electronics! Let us work with you to provide the absolute smallest layout.  Think small!
High Temperature Vacuum furnace processing with low out-gassing molybdenum internal construction.  1500 C capability. Variety of biocompatible braze alloys depending on electrochemical requirements, device stimulation parameters and we can advise on what to use for your application requirements.

Diffusion Bonding

Titanium to Titanium diffusion bonding or even Ceramic to Metal diffusion bonding for special applications

Ceramic Processing

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We can do thermal processing to 1800 C.  Ceramic sintering, annealing, microcrack healing or thick-film processing.

PVD-Sputtering

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RF-DC PVD magnetron sputtering. 3 Targets, quartz heaters, mass flow controllers for partial pressure control.  Metal or Dielectric-glass deposition.

Laser Welding   parallel gap

Plasma Cleaning

We can design and fabricate laser welded subassemblies. Parallel gap welding down to .010" (.25mm)
We also have fiber lasers capable of ablation to 10 microns, X,Y,Z motion control to less than  1 micron.

ElectroPlating

We can electroplate nickel or gold, even directly on ceramic.
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Argon Plasma cleaning RF Bias.
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